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Apacer's Latest SSD: mini mSATA M4 Apacer's Latest SSD: mini mSATA M4

Consistently devoted to the compactness and lightweight of terminal devices, Apacer rolls out mSATA Mini M4 SSD of Small Form Factor (SFF for short) to meet today's the market demands. The SSD is only 26.8 × 29.85 mm in size. Compared with mSATA SSD adopting JEDEC MO-300 standard specification, this latest model has its size reduced by over 1/2. Featuring ultra-compactness and slimness, it can break through the physical limit of the spatial design, and significantly reduce the size and weight of a terminal device. In addition, it also boasts anti-shock, anti-vibration and low power consumption, thus enabling itself to become the most reliable storage choice for portable devices applied in the military, medical equipment, on-board navigation system, tablet computer, etc.

 

 

 

Product Highlights:

• SATA 2.0 Interface & 52-pin mSATA Connector
• Capacity: 2-32GB for SLC Solution, 4-64GB for MLC Solution
• Optional write protect switch on board
• Global wear-leveling and Block Management
• Built-in ATA Secure Erase and S.M.A.R.T. Functions
• Intelligent Power Failure Recovery
• TRIM Command Support

 

 

Apacer launches CFC6 featuring transfer rate comparable to SATA Interface Apacer launches CFC6 featuring transfer rate comparable to SATA Interface

Among many varieties of memory devices, CF (CompactFlash) cards are very popular for embedded devices in such fields as medical, military, gaming, automotive and POS applications to date due to their cost effectiveness, reliability and stability. Apacer's new series of the sixth-generation CF memory cards significantly boosts the transmission efficiency up to 115/80 MB/ second, realizing the speed of SATA interface when compared with its predecessors. The new series also considerably expands its capacity up to 128GB, making it the best choice for industrial computer and automatic storage. This new series of CF memory cards takes built-in value-added functions and other features of SLC & MLC as its main axis, and adopts the standard 50-pin connector. The data transfer mode is up to PIO-6, Multi-Word DMA-4 and Ultra DMA-6, all of which are compliant with the CFA 6.0 specifications. Thanks to its PCMCIA-ATA function and compatibility that support 5V or 3.3V power supply, the sixth-generation CF memory cards provide superb convenience in terms of matching with systems and expansion of capacity.

 

Product Highlights:
• SLC Solution, MLC Solution and Premium Series 
• Compliant with CFA 6.0 specifications
• Lock switch design for write-protection
• Built-in ATA Secure Erase and S.M.A.R.T. Functions
• Advanced wear-levelling and Block Management
• Intelligent Power Failure Recovery
• MLC extended temperature support

 

 

 

 

 

Altera Announces a New Partnership with Terasic as Global Kit Reseller Altera Announces a New Partnership with Terasic as Global Kit Reseller

 

 

 

Altera Corporation (Nasdaq: ALTR) has announced that Terasic Technologies, Inc., is now an official Altera Global Kit Reseller, giving Terasic the capabillity to market and distribute all Altera official development kits.

 

Altera's development kits comprise of programmable hardware design solutions that span the entire Altera family, including the low-power, cost-efficient MAX CPLDs up to top-of-the-line Stratix FPGAs.

 

Terasic was founded in 2003 with the goal of providing educational programmable development kits that emphasized real-world applications, helping drive the success of the Altera University Program with the line of extremely popular Development and Education (DE) boards. Since then, Terasic has expanded its design applications to various fields such as prototyping, industrial, medical, financial, and more. As of 2007, Terasic has also established itself as the official manufacturing partner – and sometimes designer – for Altera kits as well.

 

 

Terasic’s success lies in the ability to provide full-bundle customized solutions , combining development kits with an assortment of daughter cards which focus on a wide range of applications including networking, storage, multimedia, interface conversion, and AD/DA.

 

Alongside hardware, Terasic also provides open-source IP that is packaged with every product, allowing users to set up a fully functional design without having to touch any code. In addition, bundled with every kit is system generation software that allows for easy selection of daughter cards to generate a top-level design in seconds, without the need for tedious pin assignments. The software allows for the customers to focus on what’s truly important - design.

 

“By enabling Terasic to become a formal reseller of Altera development kits, customers will be buying from a company that already has extensive experience in this field, a company that really cares about the success and satisfaction of world-wide development kit users,” states Terasic CEO Sean Peng. Mr. Peng further added, “Given our manufacturing partnership with Altera, our knowledge of the products is through and through, allowing us to provide the absolute best technical support for customers.”

 

With the newly announced partnership as a Global Kit Reseller, Terasic aims to leverage its expertise in providing bundle solutions to the existing base of consumers, as well as capture new markets. The addition of Altera development kits will enable an even more robust set of solutions and applications. Terasic hopes to benefit customers with its “one-stop shop” philosophy, broad development kit experience, and professional, dedicated support.

 

Apacer Unveil Two Industrial-Grade USB Drives - AH321 & AH322 Apacer Unveil Two Industrial-Grade USB Drives - AH321 & AH322

Considering the importance of data storage for embedded application, Apacer has launched two compact and portable industrial-grade USB Drives — AH321 & AH322 that boost  booth “stability” and “durability.”

The two models meet the industrial customers’ demanding requirements for system operation. With the superb reliability of SLC chips and the advantage of Fixed BOM, Apacer highlights that the firmware and major components of all the products can be fixed upon customers’ recognition and verification. This reduces the risk of out-of-stock and compatibility issues, ensuring high durability and reliability for customers.

To meet customers’ needs for cost differences between products, Apacer also introduces Industrial AH321-M & Industrial AH322-M that adopts MLC (Multi-Level Cell) chip responding to the same Fixed BOM specification mentioned above with an outstanding industrial reliability cycle MLC.

Please note:
The product is available with Housing as Standard Temperature (0/70*c) and can be supplied Without Housing in Extended Temperature (-40/+85*c) on request .

 

 

Industrial USB Drive AH321

Industrial USB Drive AH322

 

Product Highlights:
• USB 2.0 high-speed transmission
• Plug-in-and-play function
• Pen Cap design
• Windows ME/XP/ 2000/Vista, Mac OS 8.6, Linux 2.4.0 Support
• SLC Solution available in: 128MB to 32GB 
• MLC Solution available in: 4GB to 32GB

Apacer PCIE SSD Advances toward the Era of outstanding performance Apacer PCIE SSD Advances toward the Era of outstanding performance

With the ever-evolving technology and standard of transmission interface, Apacer launched its latest mPDM (mini PCIe Disk Module) modular SSD. It adopts “One lane PCIe 2.0” interface to satisfy the application requirement of high-speed transmission.

Compared to PCle 1.0, the broadband speed is boosted to 5Gb/s and the product capacity reaches up to 100GB, which will offer higher transmission speed and larger storage capacity for high-end application such as network storage or enterprise servers.

The mPDM complies with AHCI advanced motherboard controller interface and the enterprise standard NVMHCI non-volatile memory host controller interface.

Besides, the featured hot plug and plug-in-and-play functions ensure the compatibility and competitive edge of the ultra-small SSD.

To meet customers’ needs for cost differences between products, Apacer also introduces mPDM-M modular SSD that adopts MLC (Multi-Level Cell) chip.

 

 

 

Product Highlights:
- Mini PCI Express 2.0
- Compliant with PCIe 2.0 standard 
- Ultra small form factor (50.8 x 29.8 mm)
- Plug-in-and-Play function 
- SLC Solution available in :12GB, 25GB, 50GB & 100GB
- MLC Solution available in: 25GB, 50GB & 100GB                                   
- Advanced Wear-Leveling & Block Management 
- Intelligent power failure recovery

Samples are now available, please contact To-Team.

Press release: Apacer launches high-speed and low power consumption memory module dedicated to embedded systems Press release: Apacer launches high-speed and low power consumption memory module dedicated to embedded systems

As leading memory module maker, Apacer Technology Inc. has long been devoted to the industrial computer field, particularly the embedded systems. Apacer takes the lead by introducing today a memory module featuring high speed, high capacity and low power consumption as well as full compatibility with the 22-nm Ivy Bridge microprocessor platform released lately by Intel. Compared with the mainstream 8-GB DDR3-1333 memory module, Apacer’s high-speed DDR3-1600 memory module dedicated to embedded systems requires a working voltage of only 1.35V, which can be applied into the module either to the fan-less design or to the embedded system. Thanks to its 20% higher performance and 11% less power consumption, the module can save considerable power expenditure for enterprise users.

Terasic Releases New Stratix V FPGA Boards - Coming in Q3 2012 Terasic Releases New Stratix V FPGA Boards - Coming in Q3 2012

To fulfill the design needs that demand high speed, advance memory interfacing, and the highest logic capacity, Terasic has just announced a host of new FPGA boards for tackling high-bandwidth applications such as high frequency trading, data acquisition, network and signal processing, The boards come within tree flavors:

1. The TR5-Lite, which features a conveniently small form-actor

2. The DE5-NET, which maximizes memory, speed, and bandwidth capabilities

3. The TR5-F40W, which promotes flexibility and feature expansion 

 

 

 

 

 

 

 

 

 

 

 

  

For more information, please go to products

Apacer rolls out MLC Wide-temperature SSD with CF and SD Interfaces Apacer rolls out MLC Wide-temperature SSD with CF and SD Interfaces

Taipei - Despite the increase in adopting SSDs in the industrial computer sector, price remains a major concern. Apacer seeks to address this issue with a quality SSD product and has therefore introduced a large-capacity MLC wide-temp SSD with CF and SD interfaces designed for industrial computer systems and automatic applications. Favorably priced, the product employs the vendor guaranteed flash chip, which means it can run stably under industry-level extended-temperature (-40°C ~ 85°C) environments. It stays reliable even at very high or very low temperatures, which makes the SSD a great storage solution suitable for the military, aviation, automobile, oil-well drilling and other industries.

 

 

Apacer's SLC MicroSD Card - Industrial Grade - Designed for demanding industrial applications Apacer's SLC MicroSD Card - Industrial Grade - Designed for demanding industrial applications

Following many month of searching for the right solution Apacer's releases it's long awaited 1 & 2GB SLC

Micro SD Card.
Apacer stresses "stability" has always been the primary concern for industrial devices.
The greatest difference between this industrial-grade MicroSD card and other memory cards on the market lies in its firmware version and major components found in this product genuine FIXED BOM.

GO GREEN WITH APACER DDR3 1.35V ECC RDIMM GO GREEN WITH APACER DDR3 1.35V ECC RDIMM

 

 

Taking the advantage of 1.35V low voltage, Apacer DRAM DDR3 1.35V ECC RDIMM works as the best energy-saving solution for enterprise-level servers by reducing about 18% of power consumption in comparison with the standard 1.5V DDR3 memory modules. Apacer’ low-voltage ECC RDIMM memory module, designed in full compliance with JEDEC DDR3 memory standard, is a perfect fit for the server platform utilizing Intel’s lately-released Westmere-EP processor. Through the Intel Westmere-EP 3-channel server platform, this green memory module can support a transmission speed as high as DDR3 1333 MHZ. This enables the server system to decrease the heat generation and even mitigate the risk of heat crash under a 1.35V low operating voltage over the process of bulk transfer and computing. Accordingly, the power consumption for the server system is slashed, realizing effective cost control and considerably satisfying the storage requirement of enterprise consumers. Equipped with the original advanced processing chips, it has undergone harsh environment tests (high/low temperature, high/low pressure long-time burn-in test) as well as the server system and motherboard testing. Successively certified by international, leading OEM manufactures, it delivers guaranteed high product compatibility/stability in the network communication system. To order this product, please contact your Account Manager. 

Apacer launches DDR3-1600 ECC RDIMM for cloud computing storage Double capacity - higher efficiency! Apacer launches DDR3-1600 ECC RDIMM for cloud computing storage Double capacity - higher efficiency!

As cloud computing becomes mature, most enterprises have already regarded this innovative management technology as the key point to building future information architecture so as to meet the needs for the massive data processing. To fully meet the stringent demands for cloud computing, Apacer rolls out industry-leading enterprise-level 16GB bulk storage DDR3-1600 high-speed server memory module. It uses both internal and external voltage reference (Vref.) circuits, allowing the storage system to directly use external Vref. with high efficiency while eliminating signal noise.  It provides powerful computing to process on-going massive data, optimizes cloud computing and storage performance and realizes the most stable server storage environment.

 

 

Product Highlights:
• JEDEC Standard
• DDR3 Speed Grade : 1600Mbps
• Registered DIMM : 240-pin
• Memory Organization : x4/x8 FBGA DRAM chip
• DDR3 DRAM interface : SSTL_15
• CAS latency :11-11-11
• Bandwidth : 12.8GB/s
• VDD voltage : 1.5+-0.075V
• Available in 16GB
• Serial presence detect with EEPROM.
• PCB height : 1.181 inch
• RoHS Compliant
• Application : Servers/Workstations and network communication systems


 

To test or order our new DDR3-1600 ECC RDIMM  (P/N: 75.DA3D5.G000B), please contact To-Team.

Apacer launches next generation SDM4 Middle Profile wide-temperature modular SSDs Apacer launches next generation SDM4 Middle Profile wide-temperature modular SSDs

Taipei – with many years of experience in the industrial SSD sector, Apacer has been a customized product manufacturer trusted by industrial computer and server corporations in the U.S. and Japan for a long time. To provide customers with a more diverse product range, Apacer has revealed three models of the new-generation of modular SATA SSDs; the SDM4 MP (SATA Disk Module, Middle Profile), with 7-pin SATA connectors available in three orientations of 90°, 180° and 270°, along with a patented built-in power supply design. These are designed to meet user-specific needs for various form factors and industrial designs.
Compared to that of its predecessor, the reading speed of these next-generation SSDs has been boosted to 85MB/sec. Not only SLC solutions but MLC solutions can also support operating at industry-level extended-temperatures (-40°C ~ 85°C), and are especially suitable for stable operation under rigorous industrial environments.
 


 

Tectrol releases 1800W Front End for PoE & VoIP Applications with a Power Density of 25W/in3 Tectrol releases 1800W Front End for PoE & VoIP Applications with a Power Density of 25W/in3
Tectrol introduces the TFE-1800 Series of 1800 Watt Hot-Swap Power Modules with secondary isolation for PoE and VoIP applications in a 25/Win3 High Density package measuring only 11 x 4 x 1.6”
400 Watt 12V Front-End Switcher with I2C measures only 3.3 x 5 x 1.5” 400 Watt 12V Front-End Switcher with I2C measures only 3.3 x 5 x 1.5”
Date: September 7, 2011 

400 Watt 12V Front-End Switcher with I2C measures only 3.3 x 5 x 1.5"   

Tectrol introduces the TIP400 which increases the industry-standard 3.3 x 5” footprint up to 400 watts. The supply features >90% efficiency with forced air cooling.   The supply is designed for 1U applications requiring 12V Bus voltages required for next-generation high density systems.
Mellanox Announces Complete End-to-End FDR 56Gb/s InfiniBand Interconnect Solutions for Uncompromised Clustering Performance and Scalability Mellanox Announces Complete End-to-End FDR 56Gb/s InfiniBand Interconnect Solutions for Uncompromised Clustering Performance and Scalability
FDR 56Gb/s InfiniBand Enables the Highest Bandwidth, Efficiency and Flexibility for Scalable HPC, Converged Data Center and Web 2.0 Compute, Networking and Storage Infrastructures

 

ISC’11, Hamburg, Germany – June 20, 2011 – Mellanox® Technologies, Ltd. (NASDAQ: MLNX; TASE: MLNX), a leading supplier of end-to-end connectivity solutions for data center servers and storage systems, today introduced a complete solution for FDR 56Gb/s InfiniBand consisting of adapter cards, switch systems, software and cables, becoming the first company to deliver a complete and robust end-to-end FDR InfiniBand infrastructure. Mellanox’s next-generation ConnectX®-3 FDR 56Gb/s InfiniBand adapters, SX-6000 series switch systems, Unified Fabric Manager (UFM), Mellanox OS (MLNX-OS™), software accelerators and FDR copper and fiber cables deliver the highest level of networking performance while reducing system power consumption. The combination enables cost-effective networking topologies for high-performance computing, financial services, database, Web 2.0, virtualized data centers and cloud computing. 

 

Apacer Announces the New Industrial Embedded Secure Digital (SD) Card Featuring both SLC and MLC Flash Architectures Apacer Announces the New Industrial Embedded Secure Digital (SD) Card Featuring both SLC and MLC Flash Architectures
‘s Hertogenbosch, The Netherlands, 11th July 2011– Apacer, the global leader in memory module, moves fast into the sector of value-added products by launching today a new industrial SD card designed for embedded systems in harsh storage environments. The new industrial SD card features high reliability, high storage and resistance to extended temperatures. Because of these advantages the card can be widely used in industrial applications, military, communication, surveillance, medical devices and car navigation, satisfying the storage need of demanding industrial enterprises.
Renesas Electronics to Sell its U.S. Semiconductor Wafer Fabrication Facility to TELEFUNKEN Semiconductors Renesas Electronics to Sell its U.S. Semiconductor Wafer Fabrication Facility to TELEFUNKEN Semiconductors
TOKYO, Japan, and HEILBRONN, Germany, March 30, 2011—Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, and TELEFUNKEN Semiconductors GmbH & Co. KG, an automotive-qualified, mixed-signal, high-voltage (HV) power management and SOI-based manufacturer, today announced that they have signed an agreement under which Renesas Electronics America Inc. will sell its semiconductor wafer fabrication facility in Roseville, California, to TELEFUNKEN Semiconductors International LLC, a company that includes TELEFUNKEN Semiconductors GmbH. The sale price is approximately 53 million U.S. dollars, and the closing for the sale is planned for May 2, 2011. Wafra Capital Partners L.P. and Somerset Capital Group Ltd. helped TELEFUNKEN finance and facilitate the transaction, and ATREG Inc. advised Renesas Electronics throughout the transaction.
Back to school special! Buy one DE2 and get one FREE! Back to school special! Buy one DE2 and get one FREE!
 

 

Having sold more than 40,000 units worldwide, the DE2 is the number

one platform for FPGA prototyping and research. Featuring a vast array of peripherals such as VGA, RS232, Audio CODEC, and much more, the DE2 is perfectly suited for a wide range of applications such as video and image processing, sound and signal processing. Also included are free reference designs that transform the DE2 into a television box, SD Card music player, digital camera, and more! Presently more than a thousand university laboratories have been established. With the special "Back to School" event, Terasic Technologies cordially invites you to experience the DE2. The offer stands between 18th July, 2011 - 30th September, 2011.
Mellanox Introduces World’s First High Density, 36-Port 40 Gigabit Ethernet Switches for Superior Server and Storage Connectivity Mellanox Introduces World’s First High Density, 36-Port 40 Gigabit Ethernet Switches for Superior Server and Storage Connectivity
SX1000-Series of 10/40 Gigabit Ethernet High Density Switches Enable Converged Scalable Fabrics with Best-in-Class Performance, Power Efficiency and Economics for Cloud and Web 2.0 Data Centers - SX1036 Named ‘Best of Interop’ Finalist

INTEROP LAS VEGAS 2011 – May 9, 2011 – Mellanox® Technologies, Ltd. (NASDAQ: MLNX; TASE: MLNX), a leading supplier of high-performance, end-to-end connectivity solutions for data center servers and storage systems, today announced the SX1000-series of high-density 10 and 40GbE switches.  Based on the company’s recently announced, performance-leading SwitchX™ switch silicon ICs, the SX-1000 series delivers up to 2.88Tb/s of switching in a single 1U device. The SX-1000 leverages Mellanox’s unique IC architecture to deliver industry-leading capabilities in bandwidth performance, density, scalability, latency (230ns) and power. SX-1000 switches combined with additional peripherals, such as cables and Quad-to-Serial Adapters (QSA), allow for configurations as either 10GbE or 40GbE connections. The flexibility of server and uplink connectivity options provide improved efficiency, future proofing, and savings versus alternative 10GbE solutions.

 

Apacer Debuts Fifth-generation Industrial Compact Flash Card With a Lock Switch for Write-protection Apacer Debuts Fifth-generation Industrial Compact Flash Card With a Lock Switch for Write-protection
Apacer Technology Inc., the global leading memory manufacturer, announced a fifth-generation industrial compact flash card featuring write-protection design for data storage safety. Committed to safeguarding data for industrial enterprises, Apacer brings the data storage solution to a new level.
Mellanox Introduces World’s First High Density, 36-Port 40 Gigabit Ethernet Switches for Superior Server and Storage Connectivity Mellanox Introduces World’s First High Density, 36-Port 40 Gigabit Ethernet Switches for Superior Server and Storage Connectivity
INTEROP LAS VEGAS 2011 – May 9, 2011 – Mellanox® Technologies, Ltd. (NASDAQ: MLNX; TASE: MLNX), a leading supplier of high-performance, end-to-end connectivity solutions for data center servers and storage systems, today announced the SX1000-series of high-density 10 and 40GbE switches. Based on the company‟s recently announced, performance-leading SwitchX™ switch silicon ICs, the SX-1000 series delivers up to 2.88Tb/s of switching in a single 1U device. The SX-1000 leverages Mellanox‟s unique IC architecture to deliver industry-leading capabilities in bandwidth performance, density, scalability, latency (230ns) and power. SX-1000 switches combined with additional peripherals, such as cables and Quad-to-Serial Adapters (QSA), allow for configurations as either 10GbE or 40GbE connections. The flexibility of server and uplink connectivity options provide improved efficiency, future proofing, and savings versus alternative 10GbE solutions.
Mellanox Announces Industry’s Lowest Latency Standards Mellanox Announces Industry’s Lowest Latency Standards
Monday, April 26, 2010

Mellanox ConnectX-2® EN with RDMA over Ethernet (RoE) Adapters Deliver Unprecedented 1.3usec Application Latency over Lossless Ethernet to Benefit Data Center Applications to Scale Performance in the Face of Exponential Data Growth
Renesas Electronics to Sell its U.S. Semiconductor Wafer Fabrication Facility to TELEFUNKEN Semiconductors Renesas Electronics to Sell its U.S. Semiconductor Wafer Fabrication Facility to TELEFUNKEN Semiconductors
Thursday, March 31,2011 
TOKYO, Japan, and Heilbronn, Germany, March 31, 2011—Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, and
TELEFUNKEN Semiconductors GmbH & Co. KG, an automotive-qualified, mixed-signal,
high-voltage (HV) power management and SOI-based manufacturer, today announced that
they have signed an agreement under which Renesas Electronics America Inc. will sell its
semiconductor wafer fabrication facility in Roseville, California, to TELEFUNKEN
Semiconductors International LLC, a group company of TELEFUNKEN Semiconductors
GmbH & Co. KG. The sale price is approximately 53 million U.S. dollars, and the closing for the
sale is planned for May 2, 2011. Wafra Capital Partners L.P. and Somerset Capital Group Ltd.
helped TELEFUNKEN finance and facilitate the transaction, and ATREG Inc. advised Renesas
Electronics throughout the transaction.
Anti-Vibration Successfully Tested to 12G per the U.S. Military standard MIL-STD-202G Anti-Vibration Successfully Tested to 12G per the U.S. Military standard MIL-STD-202G
s'-Hertogenbosch, the Netherlands, 20th of April 2011  Apacer Technology Inc., the global leading memory module manufacturer devoted to becoming customers’ strategic partner, recently announced the strategic collaboration with Diamond Systems Corporation (DSC) based in the U.S. The move is to develop SODIMM — a specification for rugged SODIMM memory dedicated to DSC’s single-board computers (SBCs). Meeting the U.S. military MIL-STD-202G 12G vibration requirements, the newly unveiled memory module is optimal for use in military vehicle applications and other harsh environments.
Apacer's DDR3-1333 MHz Memory for Embedded/Industrial systems Apacer's DDR3-1333 MHz Memory for Embedded/Industrial systems


 

Apacer's DDR3-1333 MHz memory module for Embedded/Industrial system is available in 1GB and 2GB versions.  The module uses the latest DDR3 memory module production process technology, with a 204-pin, 1GB 128Mx8 architecture (unlike the 200-pin architecture used in DDR2 modules). The working voltage has been reduced from 1.8V with DDR2 to 1.5V, making for a 20% reduction in power consumption, and a significant improvement in battery standby time between charges.

 

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